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Microcontrollers (MCU) integrated analog circuit design trend spread. Chip manufacturers are seeking to expand abroad MCU integrating analog to digital converter (ADC), application-specific standard products of the operational amplifier (OPA) and other analog front end (AFE) program (ASSP) MCU or system-on-chip (SoC) lineup, multi-period optimization sensor data links, conversion and operation processes, accelerating from the sensed data conversion, real-time processing of Things standard mode of operation, while reducing system factory own R & D complex analog circuits time and cost pressures.
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High Guodong, general manager of Holtek Semiconductor, said sensing, MCU and radio frequency (RF) technology-based design constitute the three pillars of Things; wherein, MCU core control system not only plays, but also in charge of sensing data bridging, power management, RF signal processing and security and other critical functions, the importance is evident. With the expansion of import Things device temperature and humidity, and other diverse actions and image sensors, MCU industry have also coded layout of the more advanced sensing data bridging solutions, led a wave of MCU combination of high-precision, high-resolution analog front-end circuit SoC or ASSP design craze.
In fact, the sensors capture the external environment or user action information will be subject to a series of transmission and switching action in order to become digital signal MCU can be processed; however, sensed data conversion involves complex analog circuit design on the system works, not only technical barriers to entry are high, will also spend a lot of R & D, testing, verification, and system tuning resources. As a result, Renesas Electronics (RenesasElectronics), STMicroelectronics (ST), Texas Instruments (TI) and Holtek MCU and other competing businesses then expand the built-in analog front-end MCU product line, allows the system to focus in the digital factory processing and software development, to avoid burning the candle at both ends circumstances.
High Guodong stressed, MCU combines analog front-end, not only can significantly reduce the burden of system development and bill of materials (BOM) cost, and also the built-in firmware algorithms through the MCU, support richer action, biological and environmental sensing signaling function, will help to quickly achieve a variety of things sensing mechanism system works. Therefore, Holtek has recently added a series of built-in analog circuit MCU, and the internal ADC specifications to upgrade to 24 yuan, in order to improve the signal resolution and accuracy, sights blood sugar, body fat and other portable oxygen and medical testing equipment business.
Coincidentally, Renesas Electronics also plans to release an integrated analog front-end ASSP MCU in 2015, and will build support for optics, motion, environmental and biological sensor development platform, with the rapid expansion of the application landscape.
Renesas Electronics Marketing and Strategic Marketing Vehicle Division Director Wang Zhongyu noted Things device built-in type and number of sensors is increasing, and the entire development process, the most time-consuming part is focused on software design and testing, accounting for more than 60 to 70% of the time, if the system works must take into account not familiar analogy distracted design engineer is bound to divide up resources, and thus delayed the final product to market. In this regard, then hit a high integration of Renesas MCU design strategies and provide a complete software platform, a lot of information in order to optimize the extraction, conversion and transport processes, while reducing the impact of discrete analog components to the system power consumption and footprint space.
Obviously, in the fashion of things, MCU combines analog front-end solutions have become common school of learning, become the focus of domestic and foreign chip suppliers to compete. High Guodong think, MCU control core of things is undoubtedly the device, but with neighboring sensors, wireless networking module linked program also can not be ignored, only the tip of an overall consideration of the sensor to the MCU operation, RF transmission design requirements, Formula One victory to build things.